ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

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ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line ...

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ENIG COB package substrate

FR4 COB package substrate

6 Layer FR4 Substrate

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