Sign In | Join Free | My chinacomputerparts.com
China HongRuiXing (Hubei) Electronics Co.,Ltd. logo
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Verified Supplier

6 Years
Home > IC Package Substrate >

4L build up types 0.8mm Gold Surface IC Package Substrate

Product Categories
HongRuiXing (Hubei) Electronics Co.,Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
HongRuiXing (Hubei) Electronics Co.,Ltd.
Visit Website
City: Shenzhen
Country/Region: China
View Contact Details

4L build up types 0.8mm Gold Surface IC Package Substrate

  • 4L build up types 0.8mm Gold Surface IC Package Substrate
  • 4L build up types 0.8mm Gold Surface IC Package Substrate
Contact Now

4L build up types 0.8mm Gold Surface IC Package Substrate

Application:Dram memory electronics,IC card,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics...

Product Tags:

Horexs IC Package Substrate 0.8mm

      

Gold Surface Multilayer Pcb Board

      

0.8mm IC Package Substrate

      
Send your message to this supplier
 
*From:
*To: HongRuiXing (Hubei) Electronics Co.,Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)