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BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

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BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

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BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...

Product Tags:

BT FR4 CSP Substrate

      

4 Layer CSP Substrate

      

ENEPIG BGA Package Substrate

      
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